IEEE P370/D5, May 2019

IEEE P370/D5, May 2019 is a draft technical document for the electrical characterization of printed circuit boards and related interconnects at frequencies up to 50 GHz. It focuses on how high-speed interconnect structures are evaluated, helping engineers describe behavior more consistently in advanced signal integrity work. For designs in components, circuits, devices, and systems, this standard is relevant where accurate measurement and modeling of PCB interconnect performance can influence design confidence and test repeatability.

IEEE P370/D5, May 2019 overview

This draft standard defines a framework for characterizing printed circuit board interconnects and closely related transmission structures over a wide frequency range. IEEE P370/D5, May 2019 is intended to support more consistent electrical assessment of high-frequency board-level paths, where connector, trace, via, and launch behavior can affect results. The technical context is strongly aligned with signal integrity, measurement methodology, and model validation for engineering teams working with fast digital or mixed-signal interconnects.

Typical use cases

IEEE P370/D5, May 2019 is commonly used when evaluating PCB channels, test fixtures, and interconnect assemblies that must be characterized up to 50 GHz. It is useful in lab workflows involving network analysis, de-embedding, and comparison of measured versus simulated results. The standard may also support development programs for high-speed computing hardware, communication boards, and other electronic systems where board-level interconnect performance needs to be measured and documented with greater consistency.

Why this standard matters

Accurate characterization of PCB interconnects helps reduce uncertainty in design and testing, especially at very high frequencies. IEEE P370/D5, May 2019 provides a shared technical reference that can improve consistency across engineering teams, suppliers, and laboratories. That matters for compliance planning, procurement review, and performance verification because it helps narrow ambiguity in how interconnect behavior is assessed. In practice, it can support better comparison of results and lower risk in high-speed hardware development.

• Printed circuit board interconnect characterization
• High-frequency operation up to 50 GHz
• Measurement and de-embedding workflows
• Signal integrity and model validation
• Draft standard status: inactive