IEEE P370/D7, April 2020

IEEE P370/D7, April 2020 is a draft electrical characterization standard for printed circuit boards and related interconnects at frequencies up to 50 GHz. It addresses how high-speed PCB structures and interconnect paths may be assessed for electrical behavior in demanding RF and microwave environments. For engineers working on Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics applications, this document helps support more consistent evaluation of signal integrity and transmission performance.

Overview of IEEE P370/D7, April 2020

This draft standard focuses on methods for characterizing PCB and interconnect structures where frequency-dependent effects become significant. IEEE P370/D7, April 2020 is intended for situations where trace geometry, connectors, vias, and related transitions can influence measured or simulated response. By defining a technical basis for electrical characterization up to 50 GHz, the standard supports more comparable results across design, test, and analysis workflows in high-frequency electronics.

Typical use cases

IEEE P370/D7, April 2020 is commonly relevant in high-speed board design, fixture development, and interconnect modeling for RF-enabled systems. It may be used when validating PCB test coupons, reviewing connector or via transitions, or comparing measured and predicted behavior in laboratory characterization. The standard can also support teams working on advanced digital platforms, microwave assemblies, and other applications where board-level interconnect performance must be understood at very high frequencies.

Why it matters

Clear characterization guidance can reduce ambiguity when evaluating high-frequency PCB and interconnect performance. IEEE P370/D7, April 2020 helps organizations align testing and analysis practices, which may improve consistency between design teams, validation labs, and procurement requirements. For work near 50 GHz, small differences in measurement method or model assumptions can affect results, so a common technical reference is valuable for risk reduction, comparability, and more reliable engineering decisions.

• Draft standard for PCB and interconnect characterization
• Applicable up to 50 GHz
• Focused on high-frequency electrical behavior
• Relevant to test, modeling, and validation work
• Supports consistent interconnect performance assessment