IEC 60191-2:1966/AMD14:2006
Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
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About This Item
IEC 60191-2:1966/AMD14:2006 is a supporting amendment to the parent document,
IEC 60191-2:1966/AMD14:2006
related to mechanical standardization of semiconductor devices, with a focus on dimensions. For engineering, procurement, and conformity assessment teams, it helps keep device package references aligned with an updated dimensional framework, supporting consistent technical review and documented evaluation. As an amendment rather than a standalone base text, it should be used together with the parent reference when checking design compatibility, drawing control, or compliance workflows.IEC 60191-2:1966/AMD14:2006 standard overview
This amendment updates the mechanical standardization framework for semiconductor device dimensions under IEC 60191-2:1966. In practice, it is relevant where dimensional definitions influence package selection, mechanical fit, and product documentation. Organizations may use it during engineering validation, supplier review, and technical compliance checks to confirm that dimensional references remain consistent with the amended requirements. The document is most useful when controlled together with the parent standard as part of a traceable technical document set.
Applications of IEC 60191-2:1966/AMD14:2006
IEC 60191-2:1966/AMD14:2006 is typically applied in semiconductor-related design and review workflows where package dimensions must be matched against controlled references. It can support drafting, part-number verification, mechanical interface assessment, and test fixture planning in laboratories or manufacturing environments. Procurement and quality teams may also use it when reviewing supplier documentation or preparing conformity assessment records, especially where operational consistency and dimensional compatibility are important for downstream assembly or inspection activities.
Why IEC 60191-2:1966/AMD14:2006 matters
Using the amendment alongside the parent reference helps reduce ambiguity in mechanical documentation and supports better interoperability across engineering, testing, and purchasing functions. Dimensional consistency is important for risk management, since even small mismatches can affect fit, handling, and verification activities. For organizations preparing technical validation or quality assurance records, this amendment can help improve traceability and strengthen conformity assessment preparation without relying on outdated dimensional references.
- Supports updated dimensional control for semiconductor device documentation
- Helps maintain consistency between design data, drawings, and supplier records
- Useful in verification activities, inspection planning, and technical review
- Assists compliance workflows by keeping the parent reference and amendment aligned
- Publication Date: 2006-07-17
- Standard Status: Amendment
- Publisher: IEC
- Edition: 1
- New Version Available: IEC 60191-2:1966 (2020-02-13)
- Previous Version: IEC 60191-2:1966 (2018-12-04)
- Previous Version: IEC 60191-2:1966 (2012-02-10)
- Previous Version: IEC 60191-2:1966 (2011-11-22)
- Previous Version: IEC 60191-2:1966 (2008-05-27)
- Previous Version: IEC 60191-2:1966 (2007-07-25)
- Previous Version: IEC 60191-2:1966 (2006-07-17)
- This Version: IEC 60191-2:1966 (2006-07-17)
- Previous Version: IEC 60191-2:1966 (2006-07-17)
- Previous Version: IEC 60191-2:1966 (2006-03-24)
- Previous Version: IEC 60191-2:1966 (2004-11-23)
- Previous Version: IEC 60191-2:1966 (2004-03-29)
- Previous Version: IEC 60191-2:1966 (2003-11-19)
- Previous Version: IEC 60191-2:1966 (2003-06-27)
- Previous Version: IEC 60191-2:1966 (2002-12-02)
- Previous Version: IEC 60191-2:1966 (2002-10-05)
- Previous Version: IEC 60191-2:1966 (2002-01-05)
- Previous Version: IEC 60191-2:1966 (2001-11-27)
- Previous Version: IEC 60191-2:1966 (2001-08-28)
- Previous Version: IEC 60191-2:1966 (2001-06-20)
- Previous Version: IEC 60191-2:1966 (2001-03-15)
- Previous Version: IEC 60191-2:1966 (1966-01-01)
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